BGA PCB Circuit Board Built on 18 Layer with Dry Film Solder Mask (DFSM)

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Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 210 X 100mm
Trademark Bicheng
Origin China

Product Description

General profile BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence name BGA. It's a type of surface-mount packaging used for integrated circuits(IC). ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

Prototype Comparison

	BGA PCB Circuit Board Built on 18 Layer with Dry Film Solder Mask (DFSM) Contact Now	Quick View Multilayer PCB Board Electric Circuit Contact Now	Quick View HASL Multilayer Rigid PCB Circuit Boards Blind and Buried Holes with Immersion Gold Contact Now	Quick View Printed Circuit Board Industry in China Contact Now	Quick View High Tg Multilayer PCB Immersion Gold 94V0 Print Circuit Board Contact Now

Transaction Info
	BGA PCB Circuit Board Built on 18 Layer with Dry Film Solder Mask (DFSM) Contact Now	Quick View Multilayer PCB Board Electric Circuit Contact Now	Quick View HASL Multilayer Rigid PCB Circuit Boards Blind and Buried Holes with Immersion Gold Contact Now	Quick View Printed Circuit Board Industry in China Contact Now	Quick View High Tg Multilayer PCB Immersion Gold 94V0 Print Circuit Board Contact Now
Price	US$9.99 / Piece	US$0.10 - 80.00 / Piece	US$0.10 - 10.00 / Piece	US$0.10 - 80.00 / Piece	US$0.10 - 80.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	UL, ISO9001&ISO14001, SGS, RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report	UL, ISO9001&ISO14001, SGS, RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u''; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.25-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20 Layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz; Layers: 1-32layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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