BGA PCB Circuit Board Built on 20 Layer with 90 Ohm Impedance Controlled

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 210 X 100mm
Trademark Bicheng
Origin China

Product Description

General profile BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence name BGA. It's a type of surface-mount packaging used for integrated circuits(IC). ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

Prototype Comparison

	BGA PCB Circuit Board Built on 20 Layer with 90 Ohm Impedance Controlled Contact Now	Quick View Mustar Laser-Welded PCBA with Precision Micro-Joints for High-Quality and Durable Component Attachment Contact Now	Quick View Quick-Turn Prototype PCB for R&D Contact Now	Quick View Multi-Layer PCB for Laptop Motherboards Contact Now	Quick View Low-Noise PCB for Medical Wearables Contact Now

Transaction Info
	BGA PCB Circuit Board Built on 20 Layer with 90 Ohm Impedance Controlled Contact Now	Quick View Mustar Laser-Welded PCBA with Precision Micro-Joints for High-Quality and Durable Component Attachment Contact Now	Quick View Quick-Turn Prototype PCB for R&D Contact Now	Quick View Multi-Layer PCB for Laptop Motherboards Contact Now	Quick View Low-Noise PCB for Medical Wearables Contact Now
Price	US$9.99 / Piece	US$0.50 - 1.00 / Piece	US$0.10 - 10.00 / Piece	US$0.10 - 10.00 / Piece	US$0.10 - 10.00 / Piece
Min Order	1 Piece	10 Pieces	1 Piece	1 Piece	1 Piece
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Product Certification	-	-	ISO9001/ISO14001/CE/RoHS	ISO9001/ISO14001/CE/RoHS	ISO9001/ISO14001/CE/RoHS
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	Own Brand	Own Brand	Own Brand
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Mustar; D/C: Standard; Condition: New Original; Warranty: 2 Years; Mountng Type: SMT ,DIP; Memory Type: Standard;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry; Board Thickness: 1.6mm; Model Number: PCB; Place of Origin: Guangdong, China; Copper Thickness: 0.5oz-5oz; Min. Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Service: One-Stop OEM Service;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry; Board Thickness: 1.6mm; Model Number: PCB; Place of Origin: Guangdong, China; Copper Thickness: 0.5oz-5oz; Min. Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Service: One-Stop OEM Service;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry; Board Thickness: 1.6mm; Model Number: PCB; Place of Origin: Guangdong, China; Copper Thickness: 0.5oz-5oz; Min. Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Service: One-Stop OEM Service;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.
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