| Specification |
Application: Electronics, Medical, Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Parts;
Color: Black;
Density: 3.15;
Hardness: 16-17;
Model: Electrothermal Ceramics, GPS&Ssn;
Keyword: Silicon Nitride Parts;
Material: Hpsn Si3n4 Silicon Nitride Ceramic Rod;
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Application: Aerospace, Electronics, Medical;
Type: Boron Nitride Nozzle;
Compressive Strength: 287;
Volume Resistivity: 10^8~10^13;
Flexural Strength: 100;
Color: White;
Water Absorption: 0;
Hardness: Moh's=2;
Thermal Conductivity: 35;
Density: 1.9~2.0;
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Application: Aerospace, Electronics, Medical;
Type: Pbn Ceramic Crucible;
Volume Resistivity (25°c): 3.11X10 ^ 11Ω.Cm;
Water Absorption: 0;
Hardness: Moh's=2;
Thermal Conductivity: 35W/M.K;
Processing Service: Moulding;
Density: 2.15g/cm3;
Compressive Strength: 287MPa;
Micro Hardness (Knoop)(Abside): 691.88 N/mm²;
Maximum Use Temperature: 2200°c;
Flexural Strength: 100MPa;
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Application: Aerospace, Electronics, Medical, Refractory;
Volume Resistivity (25°c): 3.11X10 ^ 11Ω.Cm;
Color: White;
Water Absorption: 0;
Hardness: Moh's=2;
Thermal Conductivity: 35W/M.K;
Processing Service: Moulding;
Density: 2.15g/cm3;
Compressive Strength: 287MPa;
Micro Hardness (Knoop)(Abside): 691.88 N/mm²;
Maximum Use Temperature: 2200°c;
Flexural Strength: 100MPa;
|
Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Plate;
Volume Resistivity (25°c): 3.11X10 ^ 11Ω.Cm;
Color: White;
Water Absorption: 0;
Hardness: Moh's=2;
Thermal Conductivity: 35W/M.K;
Processing Service: Moulding;
Density: 2.15g/cm3;
Compressive Strength: 287MPa;
Micro Hardness (Knoop)(Abside): 691.88 N/mm²;
Maximum Use Temperature: 2200°c;
Flexural Strength: 100MPa;
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