Die Bonding Machine

US$50,000.00 - 99,999.00 / Piece

IC Wafer Highly Accurate High-Speed Precision Flip Chip Mounter Die Attach Packaging Machine Die Bonder Machine with Die Rotation System pictures & photos

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What is IC Wafer Highly Accurate High-Speed Precision Flip Chip Mounter Die Attach Packaging Machine Die Bonder Machine with Die Rotation System

Name: IC Wafer Highly Accurate High-Speed Precision Flip Chip Mounter Die Attach Packaging Machine Die Bonder Machine with Die Rotation System
Uploaded: 2025-11-07T00:24:59+08:00
Description: Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments Line Automatic die bonder for Semiconductor industry IC package MD-JC360-D MD-JC380-D MD-JC3

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$50,000.00 - 99,999.00 / Piece

Sepcifications

After-sales Service 1 Year
Condition New
Speed High Speed
Precision Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crate
Trademark minder-hightech
Origin China

Product Description

Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments Line Automatic die bonder for Semiconductor industry IC package MD-JC360-D MD-JC380-D MD-JC360 MD-JC380 MD-JC360i MD-JC380i MDAX64DI MD-1412 Automatic loading and ...

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Guangzhou Minder-Hightech co.,Ltd

Diamond Member Since 2017

Audited Supplier

Business Range Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing Machinery, Service
Year of Establishment 2014-12-30
Registered Capital 147802.18 USD
Main Markets North America, Europe

Die Bonding Machine Comparison

	IC Wafer Highly Accurate High-Speed Precision Flip Chip Mounter Die Attach Packaging Machine Die Bonder Machine with Die Rotation System Contact Now	Quick View Visual SMT Pick and Place Machine Neoden4 with 48 Tape Reel SMT Feeders Contact Now	Quick View PCB SMT Assembly Machine Neoden4 for LED, 0402, IC Mounting in SMD Assembly Line Contact Now	Quick View Neoden4 High Accuracy Desktop Pick and Place Machine SMT Machine Contact Now	Quick View Pick and Place Machine SMT Manufacturing Equipment for Electronics PCB Assembly Production Line Contact Now

Transaction Info
	IC Wafer Highly Accurate High-Speed Precision Flip Chip Mounter Die Attach Packaging Machine Die Bonder Machine with Die Rotation System Contact Now	Quick View Visual SMT Pick and Place Machine Neoden4 with 48 Tape Reel SMT Feeders Contact Now	Quick View PCB SMT Assembly Machine Neoden4 for LED, 0402, IC Mounting in SMD Assembly Line Contact Now	Quick View Neoden4 High Accuracy Desktop Pick and Place Machine SMT Machine Contact Now	Quick View Pick and Place Machine SMT Manufacturing Equipment for Electronics PCB Assembly Production Line Contact Now
Price	US$50,000.00 - 99,999.00 / Piece	US$7,499.00 / Set	US$7,499.00 - 8,799.00 / Set	US$7,499.00 / Set	US$7,499.00 - 9,697.00 / Set
Min Order	1 Piece	1 Set	1 Set	1 Set	1 Set
Payment Terms	T/T	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Product Certification	CE	ISO, CE	ISO, CE	CE	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	After-sales Service: 2 Years Warranty; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Placement Head Qty: 4PCS; Tape Reel Feeders Qty: 48; Applicable Components: 0201,BGA,Soic,Ssop,Qfn,Tqfp,LED; Max Height: 5mm; Support Tube Packed IC Feeder: 5; Tray IC Feeder Qty: 5; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz, 180W; Tape Width: 8/12/16/24mm; Packing Size: 94X74X65cm;	Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Placement Head Qty: 4PCS; Tape Reel Feeders Qty: 48; Applicable Components: 0201,BGA,Soic,Ssop,Qfn,Tqfp,LED; Max Height: 5mm; Support Tube Packed IC Feeder: 5; Tray IC Feeder Qty: 5; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz, 180W; Tape Width: 8/12/16/24mm; Packing Size: 94X74X65cm;	After-sales Service: 2 Years; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Tape Reel Feeder Qty: 48; Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201~Tqfp 144; Placement Speed: 10000cph Vision off; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Pick Nozzle Qty: 4; Tape Reel Feeder Qty: 48; Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201~Tqfp144; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray;
Supplier Name	Guangzhou Minder-Hightech co.,Ltd	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
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