| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificates: ISO13485, IATF16949, UL, CE, RoHS;
Name: PCBA SMT DIP Aoi Electronics Components Assembly;
Advantages: PCBA&EMS Manufacturer;
Item: Electronics Components Assembly;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min Trace/Space: 3/3 Mil;
Copper Thickness: 1-12 Oz;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
Application: Power and Energy, Medical Equipment, Automotive EL;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shipping Way: DHL,UPS,FedEx,by Sea;
Delivery Time: Within 3 Days(Sample);
PCBA-Testing: Aoi,X-ray,Function Test;
Copper Thickness: 1.6mm;
Min BGA Ball Pitch System: 0.4mm;
Application: Communications, Industrial Control, Semiconductors;
DIP Capacity: 100 Thousand Pins/Day;
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