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    Rk3566 Board
    US$39.90 - 47.90 / Piece
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    How to Make Customized Max 128GB ROM Android Rk3566 Motherboard Development Industrial Arm Board

    About this Item
    Details
    Company Profile

    Price

    Min. Order Reference FOB Price

    10 Pieces US$39.90 - 47.90 / Piece

    Sepcifications

    • Integrated Graphics Integrated Graphics
    • Main Chipset Rockchip
    • Maximum Memory Capacity 64G
    • Structure ATX
    • Memory DDR3
    • SATA Interface SATA3.0
    • CPU Socket LGA 775
    • Printed Circuit Board Six Layer
    • Main Board Structure Integrated
    • Audio Effects HiFi
    • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
    • Specification Customized
    • Trademark customized
    • Origin Shenzhen, China
    • Name PCBA Assembly Manufacturing
    • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
    • Advantages PCB Design/Assembly, PCBA & EMS
    • Good Services SMT, BGA and DIP
    • Production Type SMT & DIP & Assembling & Testing
    • Certificate UL94V-0+RoHS
    • Services OEM&ODM Manufacturer Since 2005
    • Item Control Board PCBA

    Product Description

    Product Description Customized Max 128GB ROM Android RK3566 Motherboard Development Industrial ARM Board Function &Interface Detailed Description CPU RK3566 Cortex-A55 quad-core, up to 1.8GHz DDR LPDDR4 2GB (4GB|8GB optional) Storage The default comes with an 16GB EMMC NAND chip that ...

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    Rk3566 Board Comparison
    Transaction Info
    Price US$39.90 - 47.90 / Piece Negotiable Negotiable Negotiable Negotiable
    Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
    Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
    Quality Control
    Product Certification UL94V-0+RoHS - - - -
    Management System Certification - - - - -
    Trade Capacity
    Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) South America, Southeast Asia/ Mideast
    Annual Export Revenue - 26,297,828.98 RMB 26,297,828.98 RMB 26,297,828.98 RMB -
    Business Model - ODM ODM ODM ODM, OEM
    Average Lead Time Peak Season Lead Time: one month
    Off Season Lead Time: one month
    Peak Season Lead Time: within 15 workdays
    Off Season Lead Time: within 15 workdays
    Peak Season Lead Time: within 15 workdays
    Off Season Lead Time: within 15 workdays
    Peak Season Lead Time: within 15 workdays
    Off Season Lead Time: within 15 workdays
    Peak Season Lead Time: within 15 workdays
    Off Season Lead Time: within 15 workdays
    Product Attributes
    Specification
    Integrated Graphics: Integrated Graphics;
    Main Chipset: Rockchip;
    Maximum Memory Capacity: 64G;
    Structure: ATX;
    Memory: DDR3;
    SATA Interface: SATA3.0;
    CPU Socket: LGA 775;
    Printed Circuit Board: Six Layer;
    Main Board Structure: Integrated;
    Audio Effects: HiFi;
    Name: PCBA Assembly Manufacturing;
    Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
    Advantages: PCB Design/Assembly, PCBA & EMS;
    Good Services: SMT, BGA and DIP;
    Production Type: SMT & DIP & Assembling & Testing;
    Services: OEM&ODM Manufacturer Since 2005;
    Item: Control Board PCBA;
    Integrated Graphics: Integrated Graphics;
    Main Chipset: Intel;
    Maximum Memory Capacity: 16G;
    Structure: ATX;
    Memory: DDR3;
    SATA Interface: SATA2.0;
    CPU Socket: LGA 775;
    Printed Circuit Board: Six Layer;
    Main Board Structure: Circuit Baded;
    Audio Effects: HiFi;
    CPU: Intel Xeon;
    Chipset: Intel Q57;
    Frequency: up to 3.3 GHz;
    BIOS: Ami Efi 64 Mbit;
    VGA: up to 1920 X 1200;
    Memory Capacity: up to 16 GB (8 GB Per DIMM);
    Operational Temperature: 0 ~ 60° C (32 ~ 140° F);
    Dimension (mm): 304.8 X 244 mm (12" X 9.6");
    EMC: Ce, FCC;
    Integrated Graphics: Integrated Graphics;
    Main Chipset: Intel;
    Maximum Memory Capacity: 16G;
    Structure: Mini-ITX;
    Memory: DDR3;
    SATA Interface: SATA2.0;
    CPU Socket: LGA 775;
    Printed Circuit Board: Six Layer;
    Main Board Structure: Circuit Baded;
    Audio Effects: HiFi;
    CPU: AMD G Series Apu T56n 1.65GHz 18W Dual Core;
    Frequency: 1.65 GHz;
    Max Speed: 1.65GHz;
    Slots: PCI, Mini-Pcie;
    LCD (Ttl/Lvds/Edp): Lvds: Dual Channel 48-Bit up to 1920 X 1200;
    Dimension (mm): 170 X 170 mm;
    EMC: Ce, FCC;
    Integrated Graphics: Integrated Graphics;
    Main Chipset: Intel;
    Maximum Memory Capacity: 16G;
    Structure: Mini-ITX;
    Memory: DDR3;
    SATA Interface: SATA2.0;
    CPU Socket: LGA 775;
    Printed Circuit Board: Six Layer;
    Main Board Structure: Circuit Baded;
    Audio Effects: HiFi;
    CPU: 4th Gen. Intel Core I7/I5/I3/Pentium/Celeron Proce;
    Frequency: 2.3 ~ 3.5 GHz;
    CPU Tdp: 95W/65W/45W/35W;
    Core Number: 4 / 2;
    BIOS: Ami Efi 64 Mbit;
    Chipset: Intel H81;
    Operating System: Microsoft Windows, Linux,Susiaccess;
    Operational Temperature: 0 ~ 60° C (32 ~ 140° F);
    Integrated Graphics: Integrated Graphics;
    Main Chipset: Intel;
    Maximum Memory Capacity: 8G;
    Structure: Micro ATX;
    Memory: DDR3;
    SATA Interface: SATA3.0;
    CPU Socket: LGA 1156;
    Printed Circuit Board: Four Layers;
    Main Board Structure: Integrated;
    Audio Effects: HiFi;
    CPU: 1st Gen;
    Supplier Name

    Shenzhen Grandtop Electronics Co., Ltd.

    Diamond Member Audited Supplier

    XINGTECH CO., LTD.

    Diamond Member Audited Supplier

    XINGTECH CO., LTD.

    Diamond Member Audited Supplier

    XINGTECH CO., LTD.

    Diamond Member Audited Supplier

    Shenzhen ITZR Technology Co., Ltd.

    Diamond Member Audited Supplier

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