Jetson Agx Orin Sensing Sg2-Ar0231c-0202-Gmsl-H30X 2MP Gmsl Camera Module Onemi 2.3MP Ar0231 Rggb Sensor Gmsl Camera Interface

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Price

Min. Order Reference FOB Price

1 Piece US$198.00 - 218.00 / Piece

Sepcifications

Application Field Industrial Control
Processor Type ARM
Stratification Operating System Layer
Range of Application General
Bus Type Not Bus Type
Type Development Board
Machine Word-Length 32
Transport Package Original Boxes
Specification 30X20X12 cm
Trademark SENSING
Origin China
Mounting Type External
Model Number Sg2-Ar0231c-0202-Gmsl-H30X
Description Sg2-Ar0231c-0202-Gmsl-H30X 2MP Gmsl Camera Module
Application Ai, Edge Computing
Series Jetson Agx Orin Series
Size / Dimension 30mm*30mm*22.5mm
Product Name Adapt to Agx Orin 2MP Gmsl Camera Module
Sensor Onemi 2.3MP Ar0231 Rggb
ISP Ap0202
Image Size 1/2.7 Inch CMOS
Output Pixel 1920h * 1080V
Pixel Size 3um * 3um
Frame Rate Frame Rate
Serializer Maxim Max96705
Connector Amphenol (Z Type Fakra)

Product Description

SENSING GMSL Camera ModuleSG2-AR0231C-0202-GMSL-H30X Condition 100% Original Warranty 3 Year Package 100% Original Package TELEFLY Telecommunications Equipment Co., Ltd., established in 2004, is a leading manufacturer in China certified by SGS. We specialize in communication ...

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Telefly Telecommunications Equipment Co., Ltd.

Diamond Member Since 2014

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Equipment housing products
Number of Employees 18
Year of Establishment 2009-09-07
Plant Area 1691 square meters
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Sg2-Ar0231c-0202-Gmsl-H30X Comparison

	Jetson Agx Orin Sensing Sg2-Ar0231c-0202-Gmsl-H30X 2MP Gmsl Camera Module Onemi 2.3MP Ar0231 Rggb Sensor Gmsl Camera Interface Contact Now	Quick View Rockchip Rk3566 Development Board Sbc Industrial Control Digital Signage Android Linux Debian Buildroot OEM ODM Development Board Contact Now	Quick View Rk3566 Som Android 0.8 Tops Npu WiFi 6 Bluetooth5.0 USB3.0 USB2.0 Mipi Edp Lvds Som Sbc for Customization Contact Now	Quick View Rk3566 Som Android 0.8 Tops Npu WiFi 6 Bluetooth5.0 USB3.0 USB2.0 Mipi Edp Lvds Som Sbc for Customization Contact Now	Quick View Rk3566 0.8tops Npc Som+Carrier Board Android Linux RJ45 USB C USB a WiFi 6 Bt5.0 Rockchip Module Board Contact Now

Transaction Info
	Jetson Agx Orin Sensing Sg2-Ar0231c-0202-Gmsl-H30X 2MP Gmsl Camera Module Onemi 2.3MP Ar0231 Rggb Sensor Gmsl Camera Interface Contact Now	Quick View Rockchip Rk3566 Development Board Sbc Industrial Control Digital Signage Android Linux Debian Buildroot OEM ODM Development Board Contact Now	Quick View Rk3566 Som Android 0.8 Tops Npu WiFi 6 Bluetooth5.0 USB3.0 USB2.0 Mipi Edp Lvds Som Sbc for Customization Contact Now	Quick View Rk3566 Som Android 0.8 Tops Npu WiFi 6 Bluetooth5.0 USB3.0 USB2.0 Mipi Edp Lvds Som Sbc for Customization Contact Now	Quick View Rk3566 0.8tops Npc Som+Carrier Board Android Linux RJ45 USB C USB a WiFi 6 Bt5.0 Rockchip Module Board Contact Now
Price	US$198.00 - 218.00 / Piece	US$34.00 - 100.00 / Piece	US$28.00 - 50.00 / Piece	US$28.00 - 50.00 / Piece	US$40.00 - 70.00 / Piece
Min Order	1 Piece	2 Pieces	2 Pieces	2 Pieces	2 Pieces
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	-	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Domestic	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Application Field: Industrial Control; Processor Type: ARM; Stratification: Operating System Layer; Range of Application: General; Bus Type: Not Bus Type; Type: Development Board; Machine Word-Length: 32; Mounting Type: External; Model Number: Sg2-Ar0231c-0202-Gmsl-H30X; Description: Sg2-Ar0231c-0202-Gmsl-H30X 2MP Gmsl Camera Module; Application: Ai, Edge Computing; Series: Jetson Agx Orin Series; Size / Dimension: 30mm30mm22.5mm; Product Name: Adapt to Agx Orin 2MP Gmsl Camera Module; Sensor: Onemi 2.3MP Ar0231 Rggb; ISP: Ap0202; Image Size: 1/2.7 Inch CMOS; Output Pixel: 1920h 1080V;* Pixel Size: 3um 3um;* Frame Rate: Frame Rate; Serializer: Maxim Max96705; Connector: Amphenol (Z Type Fakra);	Application Field: Industrial Control; Processor Type: ARM; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som; Processor: Rockchip Rk3588, 8nm, Octa-Core (4xa76 + 4xa55); OS: Android/Linux; GPU: Mali-G610 MP4, 450 Gflops; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Feature: Custom Som+Carrier Board;
Supplier Name	Telefly Telecommunications Equipment Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.
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