| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Layers: 1-50layers;
Soldermask: Green, Blue, White, Red, Black, etc.;
Silkscreen: Green, Blue, White, Red, Black, etc.;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
MOQ: 1PCS;
Test: 100%;
Service: One-Stop;
Supply: Fast;
File: PCB File;
Lead Time: 5-6 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Layers: 1-50layers;
Soldermask: Green, Blue, White, Red, Black, etc.;
Silkscreen: Green, Blue, White, Red, Black, etc.;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
MOQ: 1PCS;
Test: 100%;
Service: One-Stop;
Supply: Fast;
File: PCB File;
Lead Time: 5-6 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
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